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Nonwovens/​Converting

Dow to introduce nonwoven solutions at INDEX17

Dow will showcase its innovations and broad portfolio of resins and adhesives.

5th April 2017

Innovation in Textiles
 |  Horgen

Medical/Hygiene

Dow Packaging and Specialty Plastics business of The Dow Chemical Company will present its brand new Aspun MB Meltblown Fibre Resins and Pouchug sensory packaging technology at the upcoming INDEX17, which is taking place in Geneva, this week.

The new products are said to provide converters and brand owners unparalleled choices for improved comfort and softness in nonwoven applications. Dow will showcase its innovations and broad portfolio of resins and adhesives, demonstrating how its nonwoven solutions can help improve the well-being of consumers through protection, discreetness and maximum comfort for inclusive and active lifestyles.

Aspun MB Meltblown Fiber Resins from Dow provide choices for improved comfort and softness in nonwoven applications. © Dow

The company will also display stylish garments created by young designers from the Fashion and Arts School at Southampton Solent University, UK, made with nonwoven fibres using Dow materials.

Aspun MB Meltblown Fibre Resins

Aspun MB Meltblown Fibre Resins aim to address the challenges of increasing softness and comfort while maintaining strength, durability, and processing efficiency in fabrics such as bico-SMS nonwovens, the company explains. As a result, this new family of polyethylene (PE) resins produced using Insite Technology from Dow is suitable for nonwovens in infant diapers, adult incontinence products, medical drapes and garments, and filtration products.

“The quest for softer, more cloth-like nonwoven materials is a key driver in the ongoing development of health and hygiene products that combine comfortable fit, outstanding performance, and efficient processing,” commented Greg Bunker, senior global marketing director of Dow Health and Hygiene.

“With Aspun MB Meltblown Fiber Resins we are offering customers and brand owners something really different, an exclusive option for softer nonwovens.”

Pouchug sensory packaging technology

In nonwoven packaging applications, Pouchug sensory packaging technology from Dow enables the replacement of the external layer of a laminate with a soft, cloth-like nonwoven substrate to elevate packaging to a new level. Developed using Dow’s Pack Studio capabilities, Pouchug aims to offer on-the-shelf differentiation opportunities and an overall enhanced consumer experience.

Pouchug sensory packaging technology from Dow offers on-the-shelf differentiation opportunities and an enhanced consumer experience through a unique soft, natural look and feel. © Dow

“Dow customers and brand owners visiting our stand at INDEX17 will have the opportunity to experience our Active Comfort solutions through numerous product prototypes made with Dow’s latest technologies,” said Abby Turner, EMEA Marketing Manager, Health and Hygiene.

“We will also showcase how we are driving innovation through successful value chain collaborations, and dedicated interactive spaces will introduce visitors to Dow’s comprehensive portfolio of resins and adhesives for infant and adult hygiene applications, and much more.”

Product presentations

On the second day of the exhibition, Dow will hold two presentations at the INDEX17 Exhibitor Product Presentations. Dow professionals will introduce solutions addressing sustainability, comfort and fit and softness in baby and adult diapers, and present its binding and coating solutions for the nonwoven market, characterised by low and ultra-low formaldehyde contents and residuals.

“By combining a comprehensive portfolio of innovative resins, binding and coating solutions with excellent technical development and market expertise, Dow is the go-to partner to meet the demands of the nonwoven industry,” said Alberto Lora Lamia, Marketing Manager Adhesives at Dow.

“These unique capabilities enable us to deliver tailored, one-stop shop solutions with added functionalities and performance differentiation in many end-use applications.”

www.dow.com

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